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6-layer HDI PCB with Mobile Phone Motherboard, Immersion Gold Surface and Green Solder Mask

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Shenzhen 3c-technology Co.,Ltd
Shenzhen 3c-technology Co.,Ltd
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Tel: 86-0755-2308-6093

6-layer HDI PCB with Mobile Phone Motherboard, Immersion Gold Surface and Green Solder Mask

6-layer HDI PCB with Mobile Phone Motherboard, Immersion Gold Surface and Green Solder Mask

Product Description Board thickness: 1.0mm Min trace space: 0.1mm Min trace width: 0.1mm Surface treatment: immersion gold Solder mask: green Application: mobile phone motherboard

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